Diodes Incorporated
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PI7C9X130

PCIe-to-PCI-X Reversible Bridge

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Product Description

As one of the leading PCI Express Solution Providers, Diodes is committed to introducing a line of performance tuned PCI Express Bridge Products. The PI7C9X130 is composed of one x4 PCI Express port and one standard 64- bit /133 MHz PCIX port. The versatile PI7C9X130 is capable of both “forward” and “reverse” bridging. In “forward” mode, the PI7C9X130 is configured with the PCI Express port on the primary and the PCI/PCIX port on the downstream side. The typical usage in this configuration is to “bridge” legacy PCI/PCIX product to PCI Express systems. In “reverse” mode, the PI7C9X130 is configured with the PCIX port on the primary and the PCI Express port on the downstream side. The “reverse” configuration will be mainly used to “bridge” new PCI Express products to legacy PCI/PCIX systems. 

Industry Specifications Compliance 

  • PCI Express Base Specification, Revision 1.1
  • PCI Express CEM Specification, Revision 1.1
  • PCIe to PCI/PCI-X Bridge Specification, Rev 1.0
  • PCI-X Protocol Addendum to the PCI Local Bus Specification, Revision 2.0a
  • PCI-to-PCI Bridge Architecture Specification, Rev 1.2
  • PCI Local Bus Specification, Revision 3.0
  • PCI Hot-Plug Specification, Revision 1.1
  • PCI SHPC and Subsystem Specification, Revision 1.0
  • PCI Mobile Design Guide, Version 1.1
  • System Management (SM) Bus, Version 2.0
  • PCI Bus PM Interface Specification, Revision 1.1
  • Advanced Configuration and Power Interface Specification, Revision 2.0b

General Features 

  • Fully Reversible
    • Forward – PCIe primary, PCIX secondary
    • Reverse – PCIX primary, PCIe secondary
  • Maximum Payload Size – Up to 512 bytes
  • Industrial Temp Compliant (-40C ~ +85C)
  • Transparent and Non-transparent mode
  • GPIO Support
    • 7 dedicated bi-directional
    • When external arbiter is used:
      • 4 additional outputs
      • 4 additional inputs
  • Masquerade support
    • User defined vendor, device, revision, subsystem device, and subsystem vendor ID
  • Large 10KB Buffer
    • 4KB for upstream reads & 2KB for upstream writes
    • 2KB for downstream reads & 2KB for downstream writes
  • 17 x 17mm, 256-pin PBGA, 1mm Ball Pitch

PCI Express Features 

  • Virtual Isochronous Support
    • Upstream TC 1 – 7 generation
    • Downstream TC 1 – 7 mapping
  • 16-bit CRC, LCRC (32-bit)
  • ECRC and Advanced Error Reporting
  • Error Forwarding (Data Poisoning)
  • Polarity Toggle VDDAUX Support (1.8V)
  • Hot Plug Support

PCI/PCIX Features

  • Two Level Internal Arbitration
    • Support for up to 6 PCI and 2 PCIX bus masters
  • 3.3V Signaling with 5V I/O Tolerance
  • PME# Support
  • 16-bit Address Decode for VGA
  • CLKRUN# Support
  • VAUX Support (3.3V)
  • Hot Plug Support
  • Subsystem Device and Subsystem Vendor ID MSI and INT Support
  • SM Bus
    • PHY, data link, network layer, PEC, ARP, etc.
  • I2C Serial EEPROM Support 

Product Specifications

Product Parameters

PCI Speed 133
PCI Bus Width 64
Ports 1 PCI-X
Lanes 4
Ambient or Junction Temperature (°C) -40 to 85

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Additional Technical Documents are available upon request: 
Application information, Design tool model software, Design kits, Evaluation board, and Other technical documents

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