| Archive List of PCNs: |
| PCN # |
Issue Date |
Subject |
| PCN # 11-19 |
09/26/11 |
Adding qualified packages to copper bond wire process: ZD24, ZH20, FC64, FB48 & FD100 from Greatek assembly site and NJ100 from ASEM assembly site |
| PCN # 11-18 |
09/02/11 |
Completion of qualification on copper bond wire process for FQFP and LQFP packages (MA208, MA128 and FG64) at Greatek assembly site. |
| PCN # 11-17 |
08/19/11 |
Completed our qualification on copper bond wire process for TQFN
packages (ZF56, ZF36, ZH42, ZH32 and ZD48) at SPEL assembly site. |
| PCN # 11-15 |
07/19/11 |
Completion of package and device qualification for copper bond wire
process on the LFBGA package (NB160, NB148) at ASE Malaysia assembly site. |
| PCN # 11-13 |
06/01/11 |
Completion of package & device qualification for copper bondwire process on TQFN (ZB48) package at Greatek assembly site. |
| PCN # 11-08 |
04/15/11 |
Date code marking format changeaffecting TQFN-32 (ZL) package |
| PCN # 10-18 |
12/01/10 |
Die and marking change to PI3A268CZME |
| PCN # 11-05 |
03/23/11 |
Copper Bond wire process on LQFP at Greatek |
| PCN # 11-04 |
03/18/11 |
PI3CXXXXXXX Bus Switch Product Fab Porting and Die shrink |
| PCN # 11-06 |
03/03/11 |
All devices in TQFN-48 (ZB) assembled at Greatek. GTK ZB48 MSL change from 2 to 1 |
| PCN # 11-01 |
01/11/11 |
PI5A3157CEX and PI5A3158ZAEX that will be transferred from Global Foundry (Singapore) to Magnachip (Korea) wafer fab facility |
| PCN # 10-17 |
11/23/10 |
Adding Factory E as FCP Supplier |
| PCN # 10-15 |
11/12/10 |
Adding Factory “N” located in the Export Processing Zone of Yantai, China. as Pericom qualified manufacturing facility. The addition of this facility expands the FCP package manufacturing capability for Pericom GA (NYP, NMP) package types |
| PCN # 10-14 |
11/09/10 |
Top mark for ZF56 package has been modified to remove the Country
of Origin (COO). |
| PCN # 10-13 |
11/08/10 |
Pericom has added PSE Technology (Shandong) Corporation as qualified manufacturing facility for our FCP products which increases Pericom’s manufacturing capacity for products being assembled in FY (NKS5), FL (NKS3) package types. |
| PCN # 10-12 |
11/02/10 |
GL (49SNC, 49SAB, 49SUB) Series Solder to Epoxy Material Change |
| PCN # 10-04 |
09/10/10 |
Copper Bond wire conversion for PI7C8150x in ND 256 package from ASEM |
| PCN # 10-03 |
06/17/10 |
Datecode back mark removal for packages L8, L14, L16, Q16 and W8 |
| PCN # 10-01 |
03/18/10 |
The addition of the Changjiang (CJ) facility expands the IC package manufacturing capability for Pericom in QSOP, SOIC, SOT23, TSSOP, MSOP, SC70 and TDFN package types. |
| PCN # 08-04 |
10/20/08 |
Added a new IC package assembly site: Greatek Electronics Inc. |
| PCN # 08-02 |
07/25/08 |
PI5V330S Characterization Comparison Report |
| PCN # 08-01 |
03/27/08 |
Adding Unisem-Chengdu Package Assembly Facility for QFN-type Packages |
| PCN # 07-02 |
08/08/07 |
PI90LVXXXX Process Tranfer from TSMC Wafer Fab 7 to Fab 10 |
| PCN # 07-01 |
05/17/07 |
PI3DBV10 Die Optimization-Shrink |
| PCN # 06-07 |
12/13/06 |
Approval of SPEL's Very Thin, Dual/Quad, Flat No-lead (TDFN/TQFN) Packages |
| PCN # 06-06 |
09/15/06 |
Transfer PI3A125 Product from CSMS Fab 1 to CSMC-Tech, Wuxi (PRC) |
| PCN # 06-05 |
07/20/06 |
PSC SOTiny Gate PI74ST1G32 Ported from CSMS Fab 1 to Fab 2 |
| PCN # 06-04 |
06/30/06 |
PI7C8150A, 7C8150A-33, 7C8150B, 7C8150B-33, 7C8152A, 7C8152B transferred from TSMC Fab 7 to Fab 10 |
| PCN # 06-03 |
06/01/06 |
Porting PI5C16244 CSMS-Fab1 to CSMC-Wuxi Wafer Fab |
| PCN # 06-02 |
05/31/06 |
Porting PI5C32390 CSMS-Fab1 to CSMC-Wuxi Wafer Fab |
| PCN # 06-01 |
05/25/06 |
PI5A121 has been ported from CSM-S Fab 1 to CSMC-Wuxi Wafer Fab |
| PCN # 05-22 |
12/23/05 |
PI3V512 Die Optimization-Shrink |
| PCN # 05-21 |
12/09/05 |
PI6C2509Q and PI6C2509-133 Ported from CSM Fab 1 to Fab
2 |
| PCN # 05-20 |
12/01/05 |
PI3USB10 Die Optimization-Shrink |
| PCN # 05-19 |
11/29/05 |
SaRonix S53 series, S2274, S2275 & S2278 - Change to Laser
Marking |
| PCN # 05-18 |
11/09/05 |
SaRonix NTF3226E & NTF3238E Pb-free/RoHS Compliant Plating |
| PCN # 05-17 |
11/09/05 |
SaRonix 32S12A, 32S12B & 32S12C Pb-free/RoHS Compliant Plating |
| PCN # 05-16 |
11/08/05 |
PI3L301D Die Optimization-Shrink |
| PCN # 05-15 |
10/04/05 |
SaRonix S1800, 1803, and 1850 Series Clock Oscillator ceramic package
height is increasing from 1.15mm to 1.8mm |
| PCN # 05-14 |
10/04/05 |
SaRonix S1700, 1703 and 1750 Series Clock Oscillator package sealing
method from glass-frit to a seam-seal |
| PCN # 05-13 |
09/01/05 |
PI6C2408-2, 2408-3 and 2408-6 Moving from CSMS Fab 1 to already approved CSMS Fab 2 |
| PCN # 05-12 |
05/10/05 |
PI6C39911 has been ported from CSM-S Fab 1 to CSM-S Fab 2 |
| PCN # 05-11 |
05/06/05 |
PI6C2408-H1 has been ported from CSM-S Fab 1 to CSM-S Fab 2 |
| PCN # 05-10 |
05/05/05 |
PI6C2405A-H1 has been ported from CSM-S Fab 1 to CSM-S Fab 2 |
| PCN # 05-09 |
04/19/05 |
PI74ALVCH162244 moving from CSMS Fab 1 to Fab 2 |
| PCN # 05-08 |
04/19/05 |
PI5C3301 Product Transfer to CSMC-HJ Wafer Fab |
| PCN # 05-07 |
02/24/05 |
PI3B3244 Die Optimization-Shrink |
| PCN # 05-06 |
02/17/05 |
PI5C3244 Product Transfer to CSMC-HJ Wafer Fab |
| PCN # 05-05 |
02/11/05 |
PI6C2404A-1 Product Ported from CSMS Fab 1 to Fab 2 |
| PCN # 05-04 |
01/28/05 |
PI5C3383 Ported from CSM Fab 1 to CSMC-HJ (PRC) |
| PCN # 05-03 |
01/14/05 |
PI6C2401 & PI6C2408-1 Product Ported from CSM Fab 1 to
Fab 2 |
| PCN # 05-02 |
01/11/05 |
PI6C2402 Product Ported from CSM Fab 1 to Fab 2 |
| PCN # 05-01 |
01/04/05 |
PI6C2410 Product Ported from CSM Fab 1 to Fab 2 |
| PCN # 04-17 |
11/12/04 |
PI6C2405 & 2409 Products Ported from CSM Fab 1 to Fab 2 |
| PCN # 04-16 |
10/27/04 |
PSC SOTiny Gate Products Ported from CSMS Fab 1 to Fab 2 |
| PCN # 04-15 |
10/15/04 |
PSC 8-bit 3.3V FCT-LPT- LCX Products Ported from CSM Fab 1 to Fab
2 |
| PCN # 04-14 |
09/21/04 |
PSC PI3B3257 Die Optimization |
| PCN # 04-13 |
08/20/04 |
PI74ALVCHR162245 Ported from CSM Fab 1 to Fab 2 |
| PCN # 04-12 |
08/06/04 |
Porting Selected Clock Products from CSM Fab 1 to 2 |
| PCN # 04-11 |
06/18/04 |
Add PI5C3384C Product to Hynix Wafer Fab |
| PCN # 04-10 |
06/18/04 |
PSC PI6CVF857 Die Shrink |
| PCN # 04-09 |
06/09/04 |
Porting PSC PI5C34171C Switch from CSM Fab 1 to 2 |
| PCN # 04-08 |
04/30/04 |
PSC LPT- LCX Products Ported from CSM Fab 1 to Fab 2 |
| PCN # 04-07 |
04/08/04 |
Add 5V Switches to Hynix Wafer Fab |
| PCN # 04-06 |
03/31/04 |
Porting PSC 3V Bus Switch from CSM Fab 1 to 2 |
| PCN # 04-05 |
03/05/04 |
PSC SOTiny Gate Products Ported from CSMS Fab 1 to Fab 2 |
| PCN # 04-04 |
03/04/04 |
PSC Switch Products Ported from CSMS Fab 1 to Fab 2 |
| PCN # 04-03 |
03/01/04 |
Add PI5C16862C Product to Hynix Wafer Fab |
| PCN # 04-02 |
02/05/04 |
PSC LPT- LCX Products Ported from CSM Fab 1 to Fab 2 |
| PCN # 04-01 |
02/05/04 |
SOTiny Switch Products Ported from CSMS Fab 1 to Fab 2 |
| PDN - Product Discontinuation
Notification |
Back to Top |
| |
Product Discontinuation Notices (PDN) Obsolete Parts
Info View
all Obsolete Products |
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- PDN #11-0001 (pdf)
Last purchase date: Immediate
Last shipment date:
Immediate (see PDN notice)
- PDN #11-0002 (pdf)
Last purchase date: Immediate
Last shipment date: Immediate (see PDN notice)
- PDN #11-0003 (pdf)
Last purchase date: Immediate
Last shipment date:
Immediate (see PDN notice)
- PDN #11-0005 (pdf)
Last purchase date: April 3, 2012
Last shipment date:July 3, 2012 (see PDN notice)
- PDN #10-0205 (pdf)
Last purchase date: Immediate
Last shipment date:
May 23, 2010 (see PDN notice)
- PDN #10-1103 (pdf)
Last purchase date: May 31, 2011
Last shipment date:
Aug 31, 2011 (see PDN notice)
- PDN #10-1102 (pdf)
Last purchase date: June 9, 2011
Last shipment date:
Sept 9, 2011 (see PDN notice)
- PDN #10-1101 (pdf)
Effective Immediately for NTF3238E,
NTF3238E-F(T),
NTF3226E-F,
32S12C-F(T)
(see PDN notice)
- PDN #10-0901 (pdf)
Last Purchase Date :March 1, 2011
Last Shipment Date: June 1, 2011 (see PDN notice)
- PDN # 10-0502(pdf)
Last Purchase Date :November 19, 2010
Last Shipment Date: Februray 19, 2011 (see PDN notice)
- PDN # 10-0501(pdf)
Last Purchase Date :June 15, 2010
Last Shipment Date: September 15, 2010 (see PDN notice)
- PDN # 10-0401(pdf)
Last Purchase Date :April 8, 2010
Last Shipment Date: April 8, 2010 (see PDN notice)
- PDN # 10-0101(pdf)
Last Purchase Date :July 22, 2010
Last Shipment Date: October 22, 2010
- PDN # 09-1201(pdf)
Last Purchase Date :September 3, 2010
Last Shipment Date: December 3, 2010
- PDN #
09-0601(pdf)
Last Purchase Date: December 10, 2009
Last Shipment Date: March 10, 2010
- PDN 08-1001(pdf)
Last Purchase Date: April 3, 2009
Last Shipment Date: July 3, 2009
- PDN 08-0501(pdf)
Last Purchase Date: August 23, 2008
Last Shipment Date: November 23, 2008
- PDN 08-0201(pdf)
Last Purchase Date: August 11, 2008
Last Shipment Date: November 11, 2008
- PDN 08-0100(pdf)
Last Purchase Date: March 28, 2008
Last Shipment Date: June 30, 2008
- PDN 07-0501(pdf)
Last Purchase Date: November 30, 2007
Last Shipment Date: February 29, 2008
- PDN 06-0201(pdf)
Last Purchase Date: August 17, 2006
Last Shipment Date: November 17, 2006
- PDN 05-1201(pdf)
Last Purchase Date: June 1, 2006
Last Shipment Date: September 1, 2006
- PDN 05-0701(pdf)
Last Purchase Date: January 6, 2006
Last Shipment Date: April 8, 2006
- PDN 05-0101(pdf)
Last Purchase Date: July 8, 2005
Last Shipment Date: October 8, 2005
- PDN
04-0601(pdf)
Last Purchase Date: December 15, 2004
Last Shipment Date: March 15, 2005
- PDN
03-0701(pdf)
Last Purchase Date: January 03, 2004
Last Shipment Date: March 03, 2004
- PDN 02-0401(pdf)
Last Purchase Date: October 02, 2002
Last Shipment Date: January 02, 2003
- PDN 02-1001(pdf)
Last Purchase Date: April 1, 2003
Last Shipment Date: July 1, 2003
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Pericom
has selected Rochester Electronics to distribute obsolete/discontinued
products. Go to www.rocelec.com for
possible available stock.
Questions?
Contact Quality Support |
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